Stian Romberg

Stian Romberg is a mechanical engineer researching thermoset composites. His postdoctoral research focused on using simultaneous rheology and Raman measurements to study the evolution of the properties responsible for structural stability. Currently, he is pairing results from the rheo-Raman instrument with residual stress measurements from a multibeam optical stress sensor to understand how warpage evolves in semiconductor packages during curing and hygrothermal loading.

Publications

Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science

August 27, 2025

Author(s)

Ran Tao, Polette Centellas, Stian Romberg, Anthony Kotula, Gale Holmes, Amanda Forster, Christopher Soles, Bob Allen, Edvin Cetegen, William Chen, Jeff Gotro, Mark Poliks

This perspective builds upon insights from the National Institute of Standards and Technology (NIST)-organized workshop, "Materials and Metrology Needs for

Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials

June 26, 2025

Author(s)

Polette Centellas, Stian Romberg, Ran Tao, Alexander Landauer, Karl Schoch, Huong Giang Nguyen, Gale Holmes, Gery Stafford, Christopher Soles

Residual stresses inevitably develop in thermosetting materials used for semiconductor packaging during the curing process and in service. Understanding the

Evaluating Models That Predict Epoxy Conversion Using Rheological Properties

April 15, 2024

Author(s)

Stian Romberg, Paul Roberts, Chad R. Snyder, Anthony Kotula

Simultaneous rheology and conversion measurements of neat and composite epoxy resins reveal that conventional models neither accurately nor fully describe the

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Data and Software Publications

Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins for material extrusion

Author(s)

Stian K. Romberg, Anthony P. Kotula

Thermoset composite structures printed at room temperature using direct ink writing often collapse during thermal post-curing. This behavior suggests that the rheological properties that govern

Identifying the chemical gel point of thermoset composites using optimally windowed chirp measurements

Author(s)

Stian K. Romberg, Sarah Lehrman, Jonathan E. Seppala, Anthony P. Kotula

The chemical gel point of thermoset composites is crucial to the design of manufacturing parameters in processes and industries that utilize these materials, like additive manufacturing and

Data for A Dual Mode Brillouin/Low-Frequency Raman Spectroscopy Microscope for Local Mechanical Property Imaging for Semiconductor Packaging Materials

Author(s)

Sebastian Engmann, Andrew J. Gayle, Stian K. Romberg, Christopher L. Soles, Chris A. Michaels

The processed spectroscopic and experimental conditions (as applicable) data which are used to construct each figure is provided.

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Stian Romberg (Assoc)

Mechanical Engineer

Publications

Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science

Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials

Evaluating Models That Predict Epoxy Conversion Using Rheological Properties

Data and Software Publications

Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins for material extrusion

Identifying the chemical gel point of thermoset composites using optimally windowed chirp measurements

Data for A Dual Mode Brillouin/Low-Frequency Raman Spectroscopy Microscope for Local Mechanical Property Imaging for Semiconductor Packaging Materials