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Nicholas Jungwirth, Bryan Bosworth, Meagan Papac, Aaron Hagerstrom, Eric Marksz, Jerome Cheron, Angela Stelson, Florian Bergmann, Ari Feldman, Dylan Williams, Christian Long, Nathan Orloff
We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and
Luckshitha Suriyasena Liyanage, Nathan Orloff, Nicholas Jungwirth, Sarah Evans, Christian Long, Angela Stelson, Jacob Pawlik, James Booth
Broadband measurements are important for characterizing a wide range of materials for communications applications at microwave and mm-wave frequencies. Here we
Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long
State-of-the-art integrated circuits leverage dissimilar materials to optimize system performance. Such heterogeneous integration often involves multiple chips
Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long
Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the
Jerome Cheron, Rob Jones, Dylan Williams, Miguel Urteaga, Bryan Bosworth, Nick Jungwirth, Jeffrey Jargon, Ben Jamroz, Chris Long, Nate Orloff, Ari Feldman, Peter Aaen
We report a novel design approach of on-wafer multiline thru-reflect-line (mTRL) calibration kit fabricated on a commercial semiconductor-based transistor