A Distributed Theory for Contactless Interconnects at Terahertz Frequencies

Published

June 25, 2024

Author(s)

Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long

Abstract

Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating the interconnect's performance. We predict the performance of four distributed contactless interconnects and find good agreement between our multimodal model and 3D simulations up to 1 THz. All the interconnects have less than 1 dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects.

Citation

IEEE Transactions on Microwave Theory and Techniques

Pub Type

Journals

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Keywords

broadside-coupled coplanar waveguide, heterogeneous integration, millimeter-wave technology, bumpless, distributed circuit model

Citation

Jungwirth, N. , Bosworth, B. , Hagerstrom, A. , Papac, M. , Marksz, E. , Cheron, J. , Smith, K. , Stelson, A. , Feldman, A. , Williams, D. , Orloff, N. and Long, C. (2024), A Distributed Theory for Contactless Interconnects at Terahertz Frequencies, IEEE Transactions on Microwave Theory and Techniques, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=935516 (Accessed October 17, 2025)