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Ndubuisi George Orji

George Orji is a project leader at the Microsystems and Nanotechnology Division of the National Institute of Standards and Technology (NIST), where he works on nanoscale dimensional metrology and standards development. He received his PhD in mechanical engineering from the University of North Carolina at Charlotte. His current research interests are measurement methods development, traceability methods and uncertainty analysis for nanoscale dimensional metrology. He is a subject matter expert and delegate to the ISO Technical Committee on Surface Chemical Analysis – Scanning Probe Microscopy – TC 201-SC 9; and Chair of the Metrology Focus team of the IEEE-International Roadmap for Devices and Systems (IRDS). He is a member of IEEE, SPIE, and the American Society for Precision Engineering (ASPE).

Selected Publications

N. G. Orji, R. G. Dixson, E. Lopez, and B. Irmer, "Wear comparison of critical dimension-atomic force microscopy tips," Journal of Micro/Nanolithography, MEMS, and MOEMS, 19(1) 014004, 2020.

N. G. Orji, M. Badaroglu, B. M. Barnes, C. Beitia, B. D. Bunday, U. Celano, R. J. Kline, M. Neisser, Y. O. Vladar, and A. E., "Metrology for the next generation of semiconductor devices," Nature Electronics, vol. 1, no. 10, pp. 532–547, 2018.

R. Dixson, N. Orji, I. Misumi, and G. Dai, "Spatial dimensions in atomic force microscopy: Instruments, effects, and measurements," Ultramicroscopy, vol. 194, pp. 199-214, 2018.

N. G. Orji, H. Itoh, C. Wang, R. G. Dixson, P. S. Walecki, S. W. Schmidt, and B. Irmer, "Tip characterization method using multi-feature characterizer for CD-AFM," Ultramicroscopy, vol. 162, pp. 25-36, 2016.

N. G. Orji, R. G. Dixson, D. I. Garcia-Gutierrez, B. D. Bunday, M. Bishop, M. Cresswell, R. A. Allen, and J. A. Allgair., "Transmission electron microscope calibration methods for critical dimension standards," Journal of Micro/Nanolithography, MEMS, and MOEMS, vol. 15, no. 4, p. 044002, 2016.

Publications

Metrology for the next generation of semiconductor devices

Author(s)
Ndubuisi G. Orji, Mustafa Badaroglu, Bryan M. Barnes, Carlos Beitia, Benjamin D. Bunday, Umberto Celano, Regis J. Kline, Mark Neisser, Yaw S. Obeng, Andras Vladar
The semiconductor industry continues to produce ever smaller devices that are ever more complex in shape and contain ever more types of materials. The ultimate
Created October 9, 2019, Updated May 18, 2020