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Li-Anne Liew (Fed)
Research Interests:
Microscale mechanical testing of bulk materials; chip-scale instruments for testing of bulk materials; MEMS-based gas compressors for chip-scale refrigeration cooling systems and thermal management; flexible thermal ground planes; microsystems design, fabrication, packaging; MEMS sensors and actuators for harsh environments; cryogenic MEMS; micromechanical testing of metals for advanced packaging of semiconductors.
Project leader, MEMS & micromechanics
Professional Affiliations:
- American Society of Mechanical Engineers
- International Microelectronics Assembly and Packaging Society
- IEEE
Professional Activities:
- Track co-chair - International Conference and Exhibition on Device Packaging (International Microelectronics Assembly and Packaging Society) (2017-2019)
- Technical committee - International Conference and Exhibition on Device Packaging (International Microelectronics Assembly and Packaging Society) (2010 - 2019, 2025-2026)
- Industry-academia consulting (2009 - 2016)
Other Recent Publications:
L.A. Liew, C.Y. Lin, R. Lewis, S. Song, Q. Li, R. Yang, Y.C. Lee, “Flexible thermal ground planes fabricated with printed circuit board technology,” J. Electronic Packaging, Vol 139, no. 1, art. No. 011003, 2017.
A. Yersak, R. Lewis, L.A. Liew, R. Wen, R. Yang, Y.C. Lee, “Atomic layer deposited coatings on nanowires for high temperature water corrosion protection,” ACS App Materials and Interfaces, Vol 8, no 27, pp. 3216-32623, 2016
S.S. Xu, R.J. Lewis, L.A. Liew, Y.C. Lee, R.G. Yang, “Development of ultra-thin thermal ground planes by using stainless-steel mesh as wicking structure,” J. Microelectromechanical Systems, vol. 25, no 5, pp. 842-844, 2016.
L. Zoli, D. Sciti, D, L.A. Liew, K. Terauds, S. Azarnoush, and R. Raj, “Additive manufacturing of ceramics enabled by flash pyrolysis of polymer precursors with nanoscale layers,”. J. Am. Ceram. Soc., 99: 57–63. doi:10.1111/jace.13946 , 2015.
R. Lewis, L.A. Liew, S.S. Xu, Y.C. Lee, R.G. Yang, “Microfabricated ultra-thin all-polymer thermal ground planes,” Science Bulletin, vol. 60, no. 7, pp. 701-706, 2015. (DOI 10.1007/s11434-015-0760-9)
R. Lewis, S.S. Xu, L.A. Liew, C. Coolidge, R. Yang, Y.C. Lee, “Thin flexible thermal ground planes: fabrication and scaling characterization,” J. Microelectromechanical Systems, Vol 24, no 6, pp. 2040-2038, 2015.
Awards
- MML Accolade for measurement science excellence (2024): Technical Excellence MML Accolade 2024, Measurement Science Excellence
- NIST EEEL Directors Reserve Competitive Funding grant (2007-2008)
- Department of Commerce Silver Medal (2005)
- National Research Council Postdoctoral Fellowship (2003-2005)
- Best Paper of Session Award, 35th International Symposium on Microelectronics (International Microelectronics and Packaging Society, 2002)