Microscale mechanical testing of bulk materials; chip-scale instruments for testing of bulk materials; MEMS-based gas compressors for chip-scale refrigeration cooling systems and thermal management; flexible thermal ground planes; microsystems design, fabrication, packaging; MEMS sensors and actuators for harsh environments; atomic layer deposited films and polymer derived ceramics for microsystems, cryogenic MEMS.
Project leader, MEMS & micromechanics
Other Recent Publications:
L.A. Liew, C.Y. Lin, R. Lewis, S. Song, Q. Li, R. Yang, Y.C. Lee, “Flexible thermal ground planes fabricated with printed circuit board technology,” J. Electronic Packaging, Vol 139, no. 1, art. No. 011003, 2017.
A. Yersak, R. Lewis, L.A. Liew, R. Wen, R. Yang, Y.C. Lee, “Atomic layer deposited coatings on nanowires for high temperature water corrosion protection,” ACS App Materials and Interfaces, Vol 8, no 27, pp. 3216-32623, 2016
S.S. Xu, R.J. Lewis, L.A. Liew, Y.C. Lee, R.G. Yang, “Development of ultra-thin thermal ground planes by using stainless-steel mesh as wicking structure,” J. Microelectromechanical Systems, vol. 25, no 5, pp. 842-844, 2016.
L. Zoli, D. Sciti, D, L.A. Liew, K. Terauds, S. Azarnoush, and R. Raj, “Additive manufacturing of ceramics enabled by flash pyrolysis of polymer precursors with nanoscale layers,”. J. Am. Ceram. Soc., 99: 57–63. doi:10.1111/jace.13946 , 2015.
R. Lewis, S.S. Xu, L.A. Liew, C. Coolidge, R. Yang, Y.C. Lee, “Thin flexible thermal ground planes: fabrication and scaling characterization,” J. Microelectromechanical Systems, Vol 24, no 6, pp. 2040-2038, 2015.