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George D. Quinn

Research Interests

Mechanical testing. Reliability analysis. Fractography. Standard test methods.

Quinn copy

Figure 1(left): Guide to Practice for Fractography; Figure 2 (center): Single crystal silicon theta strength test specimen; Figure 3 (right): Broken glass rod showing classic fractographic markings.

Awards and Honors

  • McMahon Award, Alfred University, 2016
  • ASTM Committee C-28 "Advanced Ceramic" Award, 2007
  • Fellow, American Ceramic Society, 2001
  • U. S. Department of Commerce Bronze Medal, 2000
  • ASTM Certificates of Appreciation, (5), 1997-1999
  • Fellow, American Society of Testing and Materials, 1994
  • American Society of Testing and Materials Award of Merit, 1994
  • William J. Alcott Award (Best overall student in Northeastern University), 1973

Standards Outputs:

Twenty-two formal documentary standards including 15 ASTM standards, 3 Military standards, and 4 ISO standards.  Three NIST Standard Reference Materials for Knoop hardness, Vickers hardness, and fracture toughness, KIc.    Examples are:

ASTM C 1683 (2008) "Standard Practice for Size Scaling of Tensile Strengths Using Weibull Statistics for Advanced Ceramics"

This standard is the world's first standard to recommend procedures for scaling the strengths of ceramic test pieces from one configuration to another using Weibull statistics. 

ASTM C 1684 (2008) "Standard Test Method for Flexural Strength of Advanced Ceramics at Ambient Temperature – Cylindrical Rod Strength"

This standard is the world's first standard test method for cylindrical rod shaped ceramic test pieces.

ASTM C 1323 (2009 rev) "Standard Test Method for Ultimate Strength of Advanced Ceramics With Diametrally Compressed C-Ring Specimens at Ambient Temperature"

This standard, which was extensively revised in 2009, covers C-ring strength testing of ceramic test pieces, including miniature MEMS scale configuration.
 

Publications

A Standard Method for Measuring Wafer Bond Strength for MEMS Applications

Author(s)
Richard A. Allen, Janet M. Cassard, Winthrop A. Baylies, David T. Read, George D. Quinn, Frank W. DelRio, Kevin T. Turner, Michael Bernasch, Joerg Bagdahn
A round robin, to provide precision and bias data for SEMI standard MS5-1107, Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test
Created March 6, 2019