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Dev Palmer (Fed)
Director of the National Advanced Packaging Manufacturing Program
Dr. Dev Palmer is the Director of the National Advanced Packaging Manufacturing Program in the CHIPS for America Research and Development (R&D) Office. As NAPMP Director he works to advance the program mission to establish a vibrant, self-sustaining, profitable, onshore packaging industry where advanced node chips manufactured in the U.S. are packaged in the U.S. Dr. Palmer joined CHIPS for America from the Defense Advanced Research Projects Agency (DARPA) where he most recently served as Managing Director, Next-Generation Microelectronics Manufacturing at the DARPA Microsystems Technology Office.
Over his 30-year career in electronics R&D, his focus has been on conception, formulation, execution, and transition of pathfinding research project portfolios that drive technology innovation for commercial and national security applications. His passion for team building and business process improvement has played a critical role in his ability to deliver results. His work has been recognized by several awards, including the Army Research Laboratory Award for Program Management, the Secretary of Defense Award for Excellence, the IEEE Region 3 Outstanding Service Award, the DARPA Results Matter Award, and the DARPA Superior Public Service Medal.
Dr. Palmer is a registered Professional Engineer and a Life Fellow of the IEEE.
Awards
2024 DARPA Superior Public Service Award
2017 DARPA Results Matter Award
2017 DARPA Meritorious Service Award
2013 IEEE Region 3 Outstanding Service Award
2013 The Secretary of Defense Award for Excellence
2011 U.S. Army Superior Civilian Service Award
2010 U.S. Army Research Laboratory Award for Program Management