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Aaron Hagerstrom (Fed)

Publications

Characterizing interconnects to 325 GHz

Author(s)
Nicholas Jungwirth, Bryan Bosworth, Meagan Papac, Aaron Hagerstrom, Eric Marksz, Jerome Cheron, Angela Stelson, Florian Bergmann, Ari Feldman, Dylan Williams, Christian Long, Nathan Orloff
We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and

Traceable RF Power Metering Procedures With Thermoelectric Sensors

Author(s)
Zenn Roberts, Aaron Hagerstrom, Cole Gray, Angela Stelson, Vincent Neylon, Christian Long
The National Institute of Standards and Technology (NIST) maintains the United State's primary standards for traceable RF and mm-wave power measurements. These

Demonstrating Broadside-Coupled Coplanar Waveguide Interconnects to 325 GHz

Author(s)
Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long
State-of-the-art integrated circuits leverage dissimilar materials to optimize system performance. Such heterogeneous integration often involves multiple chips

A Distributed Theory for Contactless Interconnects at Terahertz Frequencies

Author(s)
Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long
Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the
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Created September 24, 2019, Updated December 8, 2022