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Physical Measurement Laboratory / Applied Physics Division

Quantum Nanophotonics Group

Patents

Searches Patent Title, Abstract, Body, Technology Type, and NIST Inventors
Displaying 1 - 3 of 3
Close-up of an emerald green circuit board highlighting the three-dimensional topography of this miniature electronic ecosystem.

Advanced Wafer Bonding for High-Density Semiconductor Integration

NIST Inventors
Nima Nader
This invention is a new method for bonding different types of computer wafers called "heterogeneous integration," which allows multiple materials and components to be combined into a single, more advanced electronic device. This invention creates matching pockets in new wafers to fit over existing
Perspective view of tweezer.

Chip Tweezers

This invention is a precision tool, specifically a type of specialized tweezer, for manipulating small samples of various materials, especially fragile microchips. These tweezers are specially designed to safely pick up and handle small, delicate items without touching their top or bottom surfaces
Chart illustrating the fiber channel structure.

A Better Way to Connect Fiber Optics to Computer Chips

NIST Inventors
Saeed Khan and Jeff Shainline
This invention provides a way to efficiently connect optical fibers to semiconductor chips. It improves the transfer of light signals between the fiber and the chip, reducing loss and increasing performance. The design allows for better alignment and integration, making it easier to manufacture and
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