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Using 3D Nanotomography to Visualize Defects in the Fabrication of Superconducting Electronics
Published
Author(s)
Aric W. Sanders, Anna E. Fox, Paul D. Dresselhaus
Abstract
Superconducting electronics is an established technological field for sensors, quantum computation and quantum-based standards and is emerging as an important low-power alternative to semiconductors. As in any electronics fabrication, the production of complex circuits requires many iterations and stringent quality control. In particular post-fabrication metrology of buried circuit elements to diagnose device failures is of utmost importance to increasing the yield and complexity of superconducting based electronics. To fill this need, we have developed methods for the 3D visualization of superconducting electronic components based on focused ion beam scanning electron (FIB-SEM) nanotomography
Sanders, A.
, Fox, A.
and Dresselhaus, P.
(2015),
Using 3D Nanotomography to Visualize Defects in the Fabrication of Superconducting Electronics, Microscopy and Microanyalsis, Portland, OR, [online], https://doi.org/10.1017/S1431927615010004
(Accessed October 10, 2025)