NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

PUBLICATIONS

Electronics Interconnections for Extreme Environments

Published

Author(s)

George G. Harman

Abstract

This article discusses the requirements for wire-bond and flip-chip interconnections that can be used in packaging semiconductor devices for extreme high and low temperature environments [from +460 'C (HTE) down to -200 'C (LTE)]. Active devices capable of operating in these environments are needed for future space-probe operation on other solar system planets, deep-well-logging, geothermal measurements, sensors near rocket and jet engines, etc.
Citation
Advanced Packaging Magazine
Pub Type
Others

Citation

Harman, G. (2004), Electronics Interconnections for Extreme Environments, Advanced Packaging Magazine (Accessed October 16, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created February 1, 2004, Updated January 27, 2020
Was this page helpful?