Calibration Strategies for Overlay and Registration Metrology

Published

May 1, 2003

Author(s)

Richard M. Silver, Michael T. Stocker, Ravikiran Attota, M R. Bishop, Jay S. Jun, Egon Marx, M P. Davidson, Robert D. Larrabee

Abstract

Critical dimensions in current and next generation devices are driving the need for tighter overlay registration tolerances and improved overlay metrology tool accuracy and repeatability. Tool matching, performance evaluation, model-based metrology, and a move towards closed-loop image placement control all increase the importance of improved accuracy and calibration methodology. The National Institute of Standards and Techology (NIST) is introducing a calibrated overlay wafer standard. A number of calibration requirements must be addressed when using this standard, including identification of the best methods for evaluating measurement bias and uncertainties, proper data acquistion and analysis, and the best calibration strategy.

Proceedings Title

Proceedings of SPIE Metrology, Inspection, and Process Control for Microlithography XVII, Daniel J. Herr, Editor May 2003

Volume

5038

Conference Dates

February 24, 2003

Conference Location

Santa Clara, CA

Conference Title

Overlay and Registration Metrology I

Pub Type

Conferences

Keywords

accuracy, measurement uncertainty, overlay tool calibration, repeatability, tool matching, traceability

Citation

Silver, R. , Stocker, M. , Attota, R. , Bishop, M. , Jun, J. , Marx, E. , Davidson, M. and Larrabee, R. (2003), Calibration Strategies for Overlay and Registration Metrology, Proceedings of SPIE Metrology, Inspection, and Process Control for Microlithography XVII, Daniel J. Herr, Editor May 2003, Santa Clara, CA (Accessed October 11, 2025)