Shepherd, D.
, Hagwood, R.
and Fields, R.
(2001),
Evaluation of the Elevated Temperature Creep Strength of Three Lead-Free Solder Alloys in Soldered Joints, Journal of Testing and Evaluation
(Accessed May 4, 2025)
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Evaluation of the Elevated Temperature Creep Strength of Three Lead-Free Solder Alloys in Soldered Joints
Published
Author(s)
, ,
Abstract
Amendments to the Safe Drinking Water Act mandated that soldered joints used in potable water systems be free of lead. In addition to lead contents, allowable pressures used in potable water systems are directly related to the elevated temperature creep strengths of the soldered joints. The National Institute of Standards and Technology (NIST) and the Copper Development Association (CDA) investigated the stress rupture behavior of lead-free soldered joints at four temperatures and various applied stresses. An extensive statistical analysis involving maximum likelihood techniques was used to generate estimated threshold stresses (below which failure in the soldered joints did not occur) as a function of composition and temperature. The results of that study for three solder alloys are given.Citation
Journal of Testing and Evaluation
Volume
29
Issue
No. 4
Pub Type
Journals
Keywords
creep strength, lead-free solder, maximum likelihood, stress rupture
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created July 1, 2001, Updated February 17, 2017