TY  - JOUR
AU  - D Shepherd
AU  - Robert Hagwood
AU  - Richard Fields
C2  - Journal of Testing and Evaluation
DA  - 2001-07-01
LA  - en
M1  - 29
PB  - Journal of Testing and Evaluation
PY  - 2001
TI  - Evaluation of the Elevated Temperature Creep Strength of Three Lead-Free Solder Alloys in Soldered Joints
ER  -