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PUBLICATIONS

Creep of Thin Film Au on Bimaterial Au/Si Microcantilevers

Published

Author(s)

Dudley Finch

Abstract

We examine creep in thin film Au to bimaterial Au/Si microcantilevers. Due to thermal expansion coefficient mismatch between the Au and Si layers, the microcantilevers show considerable out-of-pane curvatoure when subjected to a change over time. Curvature-temperature-time experiments are used to examine the effects of hold temperature and maximum annealing temperature on the inelatic response of Au films. Experiments reveal three distinct inelastic strains in the Au films-creep, recovery, and microstructural coarsening. At moderate hold temperatures 30oC
Citation
Acta Materialia
Pub Type
Journals

Keywords

Bimaterials, cantilever, creep, curvature, finite elecment analysis, gold, mems, thin fims

Citation

Finch, D. (2008), Creep of Thin Film Au on Bimaterial Au/Si Microcantilevers, Acta Materialia (Accessed October 21, 2025)

Issues

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Created October 16, 2008
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