Slifka, A.
and Drexler, E.
(2002),
Thermomechanical Effects in Embedded Passive Materials, Journal of Electronic Materials (Accessed April 29, 2026)
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Thermomechanical Effects in Embedded Passive Materials
Published
Author(s)
,
Abstract
Thermomechanical fatigue was measured using electron-beam moire (EBM) and infrared (IR) microscopy. A specimen was made using FR-4 printed wiring board, (PWB), a silver-filled conductive adhesive, and a carbon-filled conductive paste. Both filled polymeric materials are used fro embedded resistor applications. We studied the behavior of these materials and, particularly, the interfaces between these materials as a function of thermal cycling. The EBM gives quatitative information on localized strains, whereas the IR microscopy gives quantitative information on changes in heat flow. The filled polymeric materials showed strains of -0.6 % at -55 C and 1.4 % at 125 C. The interface between the silver and carbon-filled materials increased in thermal resistance on the order of 10-6 M2 K W-1 per thermal cycle.Citation
Journal of Electronic Materials
Volume
31
Issue
No. 4
Pub Type
Journals
Keywords
conductive adhesive, electron-geam moire, embedded passive, embedded resistor, infrared microscopy, thermal resistance, thermo mechanical fatigue
Citation
Issues
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Created April 1, 2002, Updated February 17, 2017