Wunsch, T.
, Kinard Jr., J.
, Manginell, R.
, Solomon, O.
and Lipe Jr., T.
(2000),
A New Fabrication Process for Planar Thin-Film Multijunction Thermal Converters, Proc., Conference on Precision Electromagnetic Measurements (CPEM), Sydney, 1, AS, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=3614
(Accessed April 30, 2024)
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A New Fabrication Process for Planar Thin-Film Multijunction Thermal Converters
Published
Author(s)
Thomas F. Wunsch, , Ronald R. Manginell, O. M. Solomon,
Abstract
Advanced thin flm processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters. The processing packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters with optimizations for improved sensitivity, bandwidth, manufacturability, and reliability.Proceedings Title
Proc., Conference on Precision Electromagnetic Measurements (CPEM)
Conference Dates
May 14-19, 2000
Conference Location
Sydney, 1, AS
Pub Type
Conferences
Download Paper
Keywords
ac-dc difference, Bosch etching, multijunction converter, planar converter, thermal converter, thin-film converter, vacuum packaging
Citation
Created April 30, 2000, Updated October 12, 2021