Combinatorial Library Designs for Quantifying Thin Film Adhesion via the Edge Delamination Test

Published

December 22, 2010

Author(s)

Jae H. Kim, Martin Chiang, D Kawaguchi, Naomi Eidelman, Christopher Stafford, Chang K. Moon

Abstract

In this paper, we demonstrate a combinatorial thin film library design for investigating the adhesion between film and substrate as measured by the edge delamination test. This library design allows rapid screening of critical parameter spaces that controls thin film reliability and bond strength in films and coatings. Specifically, our library design was aimed at quantifying the effect of thickness and temperature on the interfacial integrity of a film to an underlying substrate.To create the combinatorial library, a single specimen was fabricated having a thickness gradient of an epoxy film on a glass or silicon substrate, After dicing the film into individual squares but still contained on a single substrate, a temperature gradient is applied orthogonal to the thickness gradient to induce debonding events where the adhesion is below a critical value. The results demonstrate that our combinatorial library design and approach provides a large parameter space for accurately and reproducibly mapping the interfacial integrity and bond strength of a thin film to a substrate.

Citation

Journal of Physics D-Applied Physics

Volume

44

Issue

3

Pub Type

Journals

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Keywords

adhesion, coatings, combinatorial approach, fracture, glass, polymer, thin film

Citation

Kim, J. , Chiang, M. , Kawaguchi, D. , Eidelman, N. , Stafford, C. and Moon, C. (2010), Combinatorial Library Designs for Quantifying Thin Film Adhesion via the Edge Delamination Test, Journal of Physics D-Applied Physics, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852688 (Accessed April 18, 2024)