Transient liquid phase (TLP) bonding is an advanced die-attach technique for wide-bandgap power semiconductor and high-temperature packaging. TLP bonding advances current soldering techniques by raising the melting point to over 500 °C without detrimental high-lead materials. The bond also has greater reliability and rigidity due in part to a bonding temperature of 200 °C that drastically lowers the peak bond stresses. Furthermore, the thermal conductivity is increased 67 % while the bond thickness is substantially reduced, lowering the thermal resistance by an order of magnitude. This work provides an in-depth examination of the TLP fabrication methodology utilizing mechanical and thermal experimental characterization data along with thermal reliability results.
Proceedings Title: International Conference and Exhibition on High Temperature Electronics Network (HiTEN)
Conference Dates: July 17-18, 2011
Conference Location: Oxford, -1
Conference Title: Proceedings of the International Conference and Exhibition on High Temperature Electronics Network (HiTEN)
Pub Type: Conferences