@conference{42416,
  author = {Brian Grummel and Z. Shen and Allen Hefner},
  title = {Comparison of Au-In Transient Liquid Phase Bonding Designs for SiC Power Semiconductor Device Packaging},
  year = {2011},
  month = {2011-07-18},
  publisher = {International Conference and Exhibition on High Temperature Electronics Network (HiTEN), Oxford, -1},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=909898},
  language = {en},
}