Wu, J.
and Kim, F.
(2026),
Literature Review of Fabricated Artifacts for X-ray Computed Tomography, Advanced Manufacturing Series (NIST AMS), National Institute of Standards and Technology, Gaithersburg, MD, [online], https://doi.org/10.6028/NIST.AMS.100-81 , https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=962022 (Accessed June 23, 2026)
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Literature Review of Fabricated Artifacts for X-ray Computed Tomography
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Abstract
This report provides a comprehensive literature review of fabricated artifacts, commonly referred to as phantoms, used for the performance evaluation of X-ray computed tomography (XCT) systems. As XCT is increasingly adopted for high-precision metrology in the industrial sectors, including semiconductor manufacturing, establishing confidence in measurement results through well-characterized references is essential. This review categorizes available artifacts into two primary groups: those developed for spatial resolution assessment—such as line-pair gratings and Siemens stars—and those designed for defect detection studies. We reviewed the designs of commercial phantoms alongside recent research-driven developments at the National Institute of Standards and Technology (NIST). Special emphasis is placed on advanced microfabrication techniques, including focused ion beam (FIB) milling, laser micromachining, and deep reactive ion etching (DRIE), which enables the creation of controlled internal flaws with sub-micrometer precision. The report identifies critical challenges in the field, such as the complexities of non-destructive characterization, and the need for artifacts that better represent complex 3D geometries and multi-material composition. We conclude with recommendations for future phantom development, highlighting the necessity of standardized metrology to ensure reproducibility and compatibility across diverse XCT platforms.Citation
Advanced Manufacturing Series (NIST AMS) - 100-81
Report Number
100-81
NIST Pub Series
Pub Type
NIST Pubs
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Keywords
Defect detection, Fabricated artifacts, Metrology, Microfabrication, Nondestructive evaluation, Phantoms, Probability of detection (POD), Semiconductor packaging, Spatial resolution, X-ray computed tomography (XCT)
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Created June 22, 2026