NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

PUBLICATIONS

Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant

Published

Author(s)

Anthony Kotula, Ran Tao, Jianwei Tu, Young Lee, Gale Holmes

Abstract

Liquid encapsulants are versatile packaging materials that provide electrical insulation and mechanical protection for microelectronic devices. As more advanced encapsulants are formulated to address modern packaging needs, advanced characterization techniques are required to identify and assess recommended cure schedules. Here, we demonstrate the capabilities of differential scanning calorimetry, Fourier transform infrared spectroscopy, and rheo-Raman spectroscopy to characterize a liquid encapsulant during thermal curing. The techniques demonstrate the ability to quantify overall cure kinetics, chemical component reaction, and time-dependent mechanical properties. Our results demonstrate that a prescribed cure schedule does not necessarily completely cure an encapsulant, meaning that the resulting package properties and overall reliability will be sensitive to cure history.
Conference Dates
May 27-30, 2025
Conference Location
Dallas, TX, US
Conference Title
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Pub Type
Conferences

Download Paper

https://doi.org/10.1109/ECTC51687.2025.00303
Local Download

Keywords

microelectronics encapsulation, optoelectronics, cure kinetics, rheology, advanced packaging
Physics, Materials and Manufacturing

Citation

Kotula, A. , Tao, R. , Tu, J. , Lee, Y. and Holmes, G. (2025), Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, US, [online], https://doi.org/10.1109/ECTC51687.2025.00303, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=959539 (Accessed October 27, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created June 26, 2025, Updated July 8, 2025
Was this page helpful?