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Bottom-up Gold Filling of Sub-Micrometer Wide Trenches

Published

Author(s)

Daniel Josell, Lucia Romano, Konstantins Jefimovs

Abstract

A 〖Bi〗^(3+)-stimulated Au electrodeposition process in slightly alkaline 〖Na〗_3 Au(〖SO〗_3 )_2+〖Na〗_2 〖SO〗_3 electrolytes has been previously demonstrated for void-free bottom-up filling of progressively deeper and higher aspect trenches in gratings for advanced X-ray imaging technologies. The present work extends this bottom-up Au filling phenomenon to improve filling of small trenches. In particular, electrolytes are examined to reduce passive deposition on the sidewalls that makes filling of small, rather than high aspect ratio, features problematic. Improved Au fill in trenches as narrow as 0.5 m in width is detailed.
Citation
Journal of the Electrochemical Society
Volume
172

Keywords

gold electrodeposition, gratings, imaging, superconformal

Citation

Josell, D. , Romano, L. and Jefimovs, K. (2025), Bottom-up Gold Filling of Sub-Micrometer Wide Trenches, Journal of the Electrochemical Society, [online], https://doi.org/10.1149/1945-7111/adc493, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=959494 (Accessed May 14, 2025)

Issues

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Created April 3, 2025, Updated May 13, 2025