Liu, Y.
, Xing, D.
, McDaniel, I.
, Ozbay, O.
, Akib, A.
, Sukanya, M.
, Rekhi, S.
and Srivastava, A.
(2024),
Security Advantages and Challenges of 3D Heterogenous Integration, IEEE Computer Magazine, [online], https://doi.org/10.1109/MC.2023.3340798, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=957100
(Accessed October 13, 2025)
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Security Advantages and Challenges of 3D Heterogenous Integration
Published
Author(s)
Yuntao Liu, Daniel Xing, Isaac McDaniel, Olsan Ozbay, Abir Ahsan Akib, Mumtahina Islam Sukanya, , Ankur Srivastava
Abstract
Three-dimensional heterogeneous integration offers compelling opportunities to enhance the security and trust in the current semiconductor chain while new attack surfaces may emerge.Citation
IEEE Computer Magazine
Volume
57
Issue
3
Pub Type
Journals
Download Paper
Keywords
3D Heterogeneous Integration, Hardware Security, Split Manufacturing, Side-Channel Attacks
Citation
Issues
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Created March 6, 2024, Updated August 21, 2024