NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

EVENTS

CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Briefing

Share

NAPMP webinar
Credit: Andrew Kim

The CHIPS Research and Development Office’s vision for success of the National Advanced Packaging Manufacturing Program (NAPMP) is to establish U.S. leadership in advanced packaging and provide the technology needed for packaging manufacturing in the U.S. Subramanian Iyer, director of the NAPMP, will discuss current challenges in advanced packaging and the NAPMP’s vision for addressing them with investments in research and development.

Recording and Presentation:

You can view the recording and presentation from the webinar at https://www.nist.gov/chips/chips-america-webinars. 
 

1 hour webinar 3:00pm-4:00pm ET

Electronics, Semiconductors, Manufacturing, Standards and Frameworks
Created October 26, 2023, Updated December 6, 2023
Was this page helpful?