Polette Centellas

Publications

Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science

August 27, 2025

Author(s)

Ran Tao, Polette Centellas, Stian Romberg, Anthony Kotula, Gale Holmes, Amanda Forster, Christopher Soles, Bob Allen, Edvin Cetegen, William Chen, Jeff Gotro, Mark Poliks

This perspective builds upon insights from the National Institute of Standards and Technology (NIST)-organized workshop, "Materials and Metrology Needs for...

Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials

June 26, 2025

Author(s)

Polette Centellas, Stian Romberg, Ran Tao, Alexander Landauer, Karl Schoch, Huong Giang Nguyen, Gale Holmes, Gery Stafford, Christopher Soles

Residual stresses inevitably develop in thermosetting materials used for semiconductor packaging during the curing process and in service. Understanding the...

Visualizing Shockwave Interactions and Sub-Catastrophic Damage in Materials via Mechanophores

October 7, 2024

Author(s)

Polette Centellas, Kyle Mehringer, Andrew Bowman, Katherine Evans, Parth Vagholkar, Travis Thornell, Liping Huang, Sarah Morgan, Christopher Soles, Yoan Simon, Edwin Chan

Understanding the physical and chemical response of materials to impulsive deformation is crucial for applications ranging from soft robotic locomotion to space...

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Data and Software Publications

Data for A Switchable Longitudinal & Shear BLS Microscope for Comprehensive Modulus Imaging of Semiconductor Packaging Materials

Author(s)

Andrew J. Gayle, Sebastian Engmann, Ran Tao, Andrew G. Korovich, Polette Centellas, Yvonne B. Gerbig, Christopher L. Soles, Chris A. Michaels

This dataset contains Brillouin light scattering (BLS) measurements collected using a custom-built switchable microscope and spectrometer platform. The microscope has two configurations: 1) a

Data for Controlling the Reaction Pathway to Tune Packaging Epoxy Properties

Author(s)

Polette Centellas, Ran Tao, Huong Giang Nguyen, Jan Obrzut, Andrew Korovich, Alexander Landauer

This repository contains data from multiple modalities used to study the effect of reaction conditions on the cure of a thermosetting epoxy. The material is a model thermoset system (TM01) of

Incorporating dynamic bonds into high density polyethylene for upcycled plastic waste

Author(s)

Christopher B. Cooper, McKenzie L. Coughlin, Polette J. Centellas, Aaron A. Burkey, Kalman D. Migler, Jonathan E. Seppala, Edwin P. Chan, Chad R. Snyder, Sara V. Orski

This dataset consists of characterization of telechelic functional polyethylene oligomers, precursors, and resultant step-growth polyethylene with urethane-linkages between segments of different

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Polette Centellas (Fed)

Publications

Data and Software Publications