Skip to main content

NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Maureen E. Williams (Fed)

My research is focused on Sn whiskers. I am currently the project leader of the NIST Sn Whisker Project. This project is working on the fundamental growth mechanism of Sn whiskers.

Since 1999 I have been involved in the International Electronics Manufacturing Initiative (iNEMI) Sn whisker projects and from 2001 until 2007 was co-chair of the iNEMI Sn Whisker Modeling Group.  In 2009 I represented NIST on a team of sixteen nationally-recognized expert scientists and engineers on Phases 1 & 2 of the Lead Free Electronics Manhattan Project (LFMP), sponsored by the Office of Naval Research and the Joint Defense Manufacturing Technology Panel, to address the serious reliability threat from lead-free solders and surface finishes that are infiltrating critical aerospace and defense systems. The third phase of the LFMP project, re-named the Lead-free Electronics Risk Reduction Program, has articulated eighty research and development (R&D) tasks needed to address the lead-free technology knowledge gaps and funding is being sought to implement this R&D program.  My areas of interest include scanning electron microscopy (SEM), Focused Ion Beam (FIB), and x-ray diffraction.



 

Selected Publications

Equi-Axed Grain Formation in Electrodeposited Sn-Bi

Author(s)
E Sandnes, Maureen E. Williams, Mark D. Vaudin, Gery R. Stafford
Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity and corrosion

Whisker & Hillock Formation on Sn, Sn-Cu and Sn-Pb Electrodeposits

Author(s)
William J. Boettinger, C E. Johnson, Leonid A. Bendersky, Kil-Won Moon, Maureen E. Williams, Gery R. Stafford
Bright Sn, Sn-Cu and Sn-Pb layers, 3, 7 and 16 mm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus. Over a period of

Publications

JARVIS-Leaderboard: A Large Scale Benchmark of Materials Design Methods

Author(s)
Kamal Choudhary, Daniel Wines, Kevin Garrity, aldo romero, Jaron Krogel, Kayahan Saritas, Panchapakesan Ganesh, Paul Kent, Pascal Friederich, Vishu Gupta, Ankit Agrawal, Pratyush Tiwary, ichiro takeuchi, Robert Wexler, Arun Kumar Mannodi-Kanakkithodi, Avanish Mishra, Kangming Li, Adam Biacchi, Francesca Tavazza, Ben Blaiszik, Jason Hattrick-Simpers, Maureen E. Williams
Reproducibility and validation are major hurdles for scientific development across many fields. Materials science in particular encompasses a variety of

Data and Software Publications

AM Bench 2022 Microstructure Measurements for IN718 3D builds

Author(s)
Lyle Levine, Maureen Williams, Fan Zhang, Edwin Schwalbach, Sandra Young, Mark Stoudt, Adam Creuziger, Olaf J. Borkiewicz, Jan Ilavsky
The following data files include microstructure measurement results associated with the 2022 Additive Manufacturing Benchmark test series (AM-Bench 2022) AMB2022-01 benchmark on laser powder bed

AM Bench 2022: Cross sectional microstructure of single laser tracks produced using different processing conditions and 2D arrays of laser tracks (pads) on solid plates of nickel alloy 718

Author(s)
Lyle Levine, Maureen Williams, Mark Stoudt, Sandra Young, Jordan Weaver, David Deisenroth, Brandon Lane
The following data files include microstructure measurement results associated with the 2022 Additive Manufacturing Benchmark test series (AM Bench 2022) AMB2022-03 set of benchmarks. These AMB2022-03
Created October 9, 2019, Updated December 8, 2022
Was this page helpful?