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PUBLICATIONS

Wire Bonding to Multichip Modules and Other Soft Substrates, Multichip Modules with Integrated Sensors

Published

Author(s)

George G. Harman
Citation
W. K. Jones and G. Harsanyi Eds.
Publisher Info
Kluwer Academic Publishers,
Pub Type
Books

Citation

Harman, G. (1996), Wire Bonding to Multichip Modules and Other Soft Substrates, Multichip Modules with Integrated Sensors, Kluwer Academic Publishers, (Accessed October 1, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created December 31, 1996, Updated February 17, 2017
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