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PUBLICATIONS

Reliability and Yield Problems of Wire Bonding in Microelectronics, The Application of Materials and Interface Science, International Society for Hybrid Microelectronics (ISHM) Monograph

Published

Author(s)

George G. Harman
Citation
Reliability and Yield Problems of Wire Bonding in Microelectronics, The Application of Materials and Interface Science, International Society for Hybrid Microelectronics (ISHM) Monograph
Publisher Info
,
Pub Type
Books

Citation

Harman, G. (1989), Reliability and Yield Problems of Wire Bonding in Microelectronics, The Application of Materials and Interface Science, International Society for Hybrid Microelectronics (ISHM) Monograph, , (Accessed November 5, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created October 18, 1989, Updated February 17, 2017
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