TY  - SER
AU  - George Harman
C2  - ,  
DA  - 1989-10-18
LA  - en
PB  - ,  
PY  - 1989
TI  - Reliability and Yield Problems of Wire Bonding in Microelectronics, The Application of Materials and Interface Science, International Society for Hybrid Microelectronics (ISHM) Monograph
ER  -