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Biden-Harris Administration Announces CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity and Create Tens of Thousands of Jobs

November 26, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Inc., and Rocket Lab to Expand Production of Chips Critical for U.S. National Security and Space Industry

November 25, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s

NIST Report on the 2024 Accordion Cipher Mode Workshop

November 21, 2024

NIST hosted the N IST Workshop on the Requirements for an Accordion Cipher Mode 2024 on June 20–21, 2024, at the National Cybersecurity Center of Excellence

NEW | NIST Privacy Workforce Taxonomy, Initial Public Draft

November 21, 2024

The NIST Privacy Framework Team is pleased to announce the release of the NIST Privacy Workforce Taxonomy, Initial Public Draft (IPD)! The Privacy Workforce

NIST Transfers Evidence From Champlain Towers South to Miami-Dade Police Department

November 21, 2024

The National Construction Safety Team has reached an important milestone in its investigation into the 2021 partial collapse of Champlain Towers South.

CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging

November 21, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced

CESMII and NIST MEP Partner to Boost U.S. Manufacturing with Smart Technologies

November 20, 2024

The Clean Energy Smart Manufacturing Innovation Institute (CESMII), part of the Manufacturing USA network, and the National Institute of Standards and

FACT SHEET: U.S. Department of Commerce & U.S. Department of State Launch the International Network of AI Safety Institutes at Inaugural Convening in San Francisco

November 20, 2024

San Francisco, California – Today the U.S. Department of Commerce and U.S. Department of State are co-hosting the inaugural convening of the International

U.S. AI Safety Institute Establishes New U.S. Government Taskforce to Collaborate on Research and Testing of AI Models to Manage National Security Capabilities & Risks

November 20, 2024

Washington, D.C. — Today, the U.S. Artificial Intelligence Safety Institute at the U.S. Department of Commerce’s National Institute of Standards and Technology

Biden-Harris Administration Announces CHIPS Incentives Award with GlobalFoundries to Strengthen Essential Chip Supply for Key U.S. Industries Including Auto and Defense

November 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded GlobalFoundries (GF) up to $1.5 billion in direct funding under

Pre-Deployment Evaluation of Anthropic’s Upgraded Claude 3.5 Sonnet

November 19, 2024

Introduction The U.S. Artificial Intelligence Safety Institute (US AISI) and the UK Artificial Intelligence Safety Institute (UK AISI) conducted a joint pre

CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins, Headquartered in North Carolina

November 19, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium

Incoming radiation deposits energy into the TKID circuit.

NIST Study Probes the Damaging Effects of Radiation on Qubits

November 19, 2024

Qubits, the fundamental unit of quantum information, form the building blocks of quantum computers. Because qubits are not limited to the two states, “0” and “1

Unlocking Cybersecurity Talent: The Power of Apprenticeships

November 18, 2024

By: Marian Merritt Cybersecurity is a fast-growing field, with a constant need for skilled professionals. But unlike other professions — like medicine or

Melissa Midzor Named Director of NIST’s Communications Technology Laboratory

November 18, 2024

The lab focuses on advancing communications technology through research and development in core network technologies, next-generation wireless systems, public

NIST Requests Public Comments on SP 800-102, Recommendation for Digital Signature Timeliness

November 15, 2024

NIST maintains its cryptography standards and guidelines using a periodic review process. NIST requests public comments on all aspects of NIST Special

Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology

November 15, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan

Guidelines for Derived PIV Credentials and PIV Federation: SP 800-157r1 and SP 800-217 Available for Public Comment

November 14, 2024

The final public drafts (fpd) of NIST Special Publication (SP) 800-157r1 (Revision 1), Guidelines for Derived Personal Identity Verification (PIV) Credentials

AI Can ‘Hear’ When a Lithium Battery Is About to Catch Fire

November 14, 2024

NIST researchers have trained AI to detect the telltale sound even in noisy environments.

NIST Invites Comments on Enhanced Security Requirements for Protecting Controlled Unclassified Information

November 13, 2024

(1/8/25) The public comment period has been extended through January 17, 2025.

NIST Releases IR 8517, Hardware Security Failure Scenarios: Potential Weaknesses in Hardware Design

November 13, 2024

NIST Internal Report (IR) 8517, Hardware Security Failure Scenarios: Potential Weaknesses in Hardware Design, has now been finalized. Hardware is often assumed

The Future is Open: What is Open RAN and How NIST is Helping

November 13, 2024

The future of your mobile network is faster, more cost effective, more intelligent, and more secure—one that breaks free from the limitations of the existing

Biden-Harris Administration Announces Preliminary Terms with Akash Systems to Support Development and Production of Emerging Semiconductor Technology

November 13, 2024

Today, the Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms

Transition to Post-Quantum Cryptography Standards | Draft NIST IR 8547 is Available for Comment

November 12, 2024

The initial public draft of NIST Internal Report (IR) 8547, Transition to Post-Quantum Cryptography Standards , is now available for public comment. This report

Side-by-side photos show a buoy with attached scientific devices on the deck of a ship and then floating in the ocean.

Spotlight: NIST Dives In to Help Measure Ocean Color

November 8, 2024

Thanks to a collaboration between NASA and NIST, a new ocean color sensor buoy has been deployed off the western coast of Australia.

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Advanced communications
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NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
---CHIPS Program Headquarters
----CHIPS Program Headquarters - HQ
----Opportunity & Inclusion Group
---External & Government Affairs Division
----External & Government Affairs – HQ
---Investments Division
----Investments Division – HQ
---Operations Office
----Operations Office – HQ
---Risk Management Division
----Risk Management – HQ
---Strategy, Technology & Policy Division
----Strategy, Technology & Policy – HQ
--CHIPS Research & Development Program Office
---CHIPS Research & Development Program Headquarters Division
----CHIPS Research & Development Program Headquarters – HQ
----Integration & Policy Office
----Outreach & Partnerships Office
---External R&D Partnerships Division
----External R&D Partnerships – HQ
----National Advanced Packaging Manufacturing Program Group
----National Semiconductor Technology Center Group
---Industrial Advisory Committee
----Industrial Advisory Committee – HQ
---Semiconductor Manufacturing Institute Division
----Semiconductor Manufacturing Institute – HQ
---Semiconductor Metrology & Characterization Office
----Semiconductor Metrology & Characterization Office – HQ
-Management Resources
--Management Resources
---Associate Director for Management Resources
----Associate Director for Management Resources - HQ
---Business Operations Office
----Business Analytics Group
----Business Operations Office - HQ
----Customer Relationship Management Group
----Process Engineering Office
----Project Management Office
---Emergency Services Office
----Emergency Management, Preparedness and Coordination Group
----Emergency Services - HQ
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---Equal Employment Opportunity and Accessibility Office
----Equal Employment Opportunity and Accessibility - HQ
---NIST Research Library and Museum
----Research Library Group
----Digital Services and Publishing Group
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---Fabrication Technology Office
----Fabrication Technology Office - HQ
--Office of Facilities and Property Management
---Boulder Design and Construction Division
----Boulder Design and Construction - HQ
----Facilities Improvement (Boulder) Group
----Reimbursable Work Group
----Facilities Modernization (Boulder) Group
---Gaithersburg Design and Construction Division
----Facilities Improvement (Gaithersburg) Group
----Reimbursable Work (Gaithersburg) Group
----Facilities Library, Archives, and As-Built (Gaithersburg) Group
----Construction Contract Management Group
----Facilities Modernization (Gaithersburg) Group
----Gaithersburg Design and Construction - HQ
---Gaithersburg Facility Maintenance Division
----Building Management (Gaithersburg) Group
----Operations Engineering Group
----Gaithersburg Facility Maintenance - HQ
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----Office of Acquisition and Agreements Management - HQ
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----Financial Assistance Agreements Management Office – HQ
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----Acquisition Management - HQ
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--Office of Information Systems Management
---Applications Systems Division
----Applications Systems - HQ
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----Service Delivery Excellence - HQ
---Business Systems Division
----Business Systems Division - HQ
---Information Technology Security & Networking Division
----Information Technology Security & Networking - HQ
---Identity, Credential, and Access Management Division
----Identity, Credential, and Access Management - HQ
---Customer Access and Support Division
----Customer Access and Support - HQ
---Infrastructure Services Division
----Infrastructure Services Division - HQ
---Office of Information Systems Management
----Office of Information Systems Management - HQ
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----Platform Services Division - HQ
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---Learning and Organizational Development Division
----Learning and Organizational Development – HQ
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----Workforce Analytics and Technology – HQ
---Human Resources Management Office
----Human Resources Management Office - HQ
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----Workforce Programs – HQ
--Office of Safety, Health and Environment
---Office of Safety, Health and Environment
----Office of Safety, Health and Environment - HQ
---Gaithersburg Safety, Health and Environment Division
----Safety and Health Group
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----Fire and Facilities Safety Group
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---Radiation Safety Division
----Radiation Facilities Group
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----Radiation Safety - HQ
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----Boulder Safety, Health and Environment - HQ
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---Financial Systems and Reporting Division
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----Financial Systems and Reporting Division - HQ
----Financial Statements Group
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---Office of Financial Resource Management
----Office of Financial Resource Management - HQ
----Internal Controls Management & Evaluation Office
----Enterprise Risk Management Office
---Finance Division
----Finance - HQ
----Financial Statements Group
----Data Control and Cost Execution Group
----Accounts Payable Purchase Orders, Grants & Foreign Payments
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----Receivables Group
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----Travel Group
---Financial Operations Division
----Travel Group
----Agreements Group
----Accounts Receivable Group
----Accounts Payable II Group
----Financial Operations - HQ
----Accounts Payable Group
---Budget Division
----Technical and Extramural Programs Group
----Institutional Support and Facilities Group
----Budget - HQ
----Formulation and Financial Management Group
-Laboratory Programs
--Communications Technology Laboratory
---RF Technology Division
----High-Speed Waveform Metrology Group
----Superconductive Electronics Group
----Metrology for Wireless Systems Group
----Guided Wave Electromagnetics Group
----Electromagnetic Fields Group
----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
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----Smart Connected Manufacturing Systems Group
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----Shared Spectrum Metrology Group
----Spectrum Technology and Research – HQ
---Wireless Networks Division
----Internet Technologies Research Group
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----Wireless Networks Division - HQ
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---Public Safety Communications Research Division
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----Advanced Communications Research Group
----Network Operations Group
---Communications Technology Laboratory HQ
----Communications Technology Laboratory HQ Gp
----Boulder Laboratory Director Office
----Communication Test Coordination Office
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---Building Energy and Environment Division
----Building Energy and Environment - HQ
----Mechanical Systems and Controls Group
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---Intelligent Systems Division
----Intelligent Systems - HQ
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---Materials and Structural Systems Division
----Earthquake Engineering Group
----Engineering Research Support Group
----Infrastructure Materials Group
----Inorganic Materials Group
----Community Resilience Group
----Materials and Structural Systems - HQ
----Polymeric Materials Group
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---Engineering Laboratory Office
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----Engineering Laboratory - HQ
----Engineering Laboratory Data, Security, Technology Group
---Fire Research Division
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----Wildland Urban Interface Fire Group
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----Fire Research - HQ
----Engineered Fire Safety Group
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---Systems Integration Division
----Life Cycle Engineering Group
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----Information Modeling and Testing Group
----Systems Integration - HQ
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---Applied Cybersecurity Division
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----Cybersecurity and Privacy Applications Group
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----Applied and Computational Mathematics - HQ
---Statistical Engineering Division
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----Statistical Engineering - HQ
---Software and Systems Division
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----Software and Systems - HQ
----Cyber Infrastructure Group
----Information Systems Group
---Information Access Division
----Information Access - HQ
----Biometric Technologies Group
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----Information Integrity Technologies Group
----Human-Centered Technologies Group
---Information Technology Laboratory Office
----Office of Computational Science for Metrology
----Office of Emerging Technologies
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----Office of Government and Industrial Liaison
----Information Technology Laboratory Office - HQ
----Office of Chief Cybersecurity Advisor
--Laboratory Programs
---Research Data and Computing Office
----Research Data and Computing Office – HQ
---Research Protections Office
----Research Protections Office - HQ
---Research Security and Safeguarding Science Office
----Research Security and Safeguarding Science - HQ
---Standards Coordination Office
----International Standards Policy and Coordination Group
----Standards and Conformity Assessment Services Group
----Standards Coordination Office - HQ
----National Voluntary Laboratory Accreditation Program (NVLAP)
---Special Programs Office
----Special Programs Office-HQ
----Law Enforcement Standards Office
---Associate Director for Laboratory Programs
----Associate Director for Laboratory Programs - HQ
--Material Measurement Laboratory
---Office of Reference Materials
----Business and Quality Management Group
----Business Application Development, Support, and Security Group
----Sales and Customer Services Group
----Publication and Web Services Group
----Office of Reference Materials - HQ
----Materials and Physical Services Group
---Office of Data and Informatics
----Office of Data and Informatics - HQ
----Data Services Group
----Data Sciences Group
---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Genome-Scale Measurements Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Chemical Informatics Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Environmental Chemical Sciences Group
----Chemical Sciences Division - HQ
----Marine Biochemical Sciences Group
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Atomic Standards Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Ultraviolet Radiation Group
----Sensor Science - HQ
----Dimensional Metrology Group
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Quantum Devices Group
----Molecular and Bio-Photonics Group
----Optoelectronic Manufacturing Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Processing Group
----Quantum Sensors Group
----Quantum Sensors – HQ
----Nanoscale Spin Dynamics Group
----Microfabrication Group
----Spin Electronics Group
----Magnetics Group
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Nanoscale Processes and Measurements Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
----Center for Nanoscale Science and Technology
----Office of Weights and Measures
----Boulder Laboratory Director Office
-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
----Semiconductor Coordination Group
----Semiconductor Operations Group
----Workforce and Equity Development Group
---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
----Communications and Marketing Group
----Education and Workforce Development Group
----Partnership Engagement Group
----Partnerships and Outreach – HQ
----Technology Hubs Development Group
---Program Operations Division
----Competitions Group
----Institute and Program Management Group
----Performance Management Group
----Program Operations - HQ
---Strategy and Planning Division
----Analysis and Benchmarking Group
----Strategic Planning Group
----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
----Economic Analysis Office - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
---Technology Innovation Program Office
----Technology Innovation Program Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Network Learning and Strategic Competitions Division
----Network Learning and Strategic Competitions - HQ
---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Regional and State Partnerships Division
----Regional Management Group
----Regional and State Partnerships - HQ
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
----Center Operations and Financial Management Group
---Extension Services Division
----Extension Services - HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Ombuds Office
----Ombuds Office - HQ
---Public Affairs Office
----Media Liaison Group
----Video and Digital Media Production Group
----Public Affairs Office - HQ
----Internal Communications and Inquiries Group
----Conference Program and Audiovisual Services Group
----Boulder Meetings Support and Services Group
----Web Content Development Group
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
----Onboarding Group
---Congressional and Legislative Affairs Office
----Congressional and Legislative Affairs Office - HQ
---Human Subjects Protection Office
----Human Subjects Protection Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ