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CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Summit

CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Summit

The National Advanced Packaging Manufacturing Program (NAPMP) and NASA Ames Research Center in California’s Silicon Valley are co-hosting an Advanced Packaging Summit as a hybrid virtual and in-person event at the NASA Ames Conference Center in Moffett Field, California.  The Summit will run from 8:30 a.m. - 5:30 p.m. PDT from April 18 - 19, 2024.  This event will bring together technical experts from industry, academia, government, and industry alliances to identify key technical challenges and strategic approaches in advanced semiconductor packaging.

The Summit will be a place to foster collaboration, coordination, and innovation within the advanced packaging community. Participants will discuss:

  • Strategic technical challenges in advanced packaging
  • An overview of advanced packaging efforts in the government and private sectors
  • The goals of the NAPMP program in the context of CHIPS for America, CHIPS Incentives, and CHIPS R&D
  • A vision for a National Advanced Packaging Prototyping Facility (NAPPF).

This two-day hybrid event provides an opportunity to network and exchange ideas with thought leaders across the sector. Both days feature plenary and panel sessions with exemplary keynote and guest speakers mixed with interactive breakout sessions. Collectively, these sessions provide an opportunity for participants to collaborate and discuss key questions and topics that will shape future advanced packaging efforts. Topics to be considered include:

  • Packaging Equipment, Tools, and Processes
  • Chiplets Ecosystem
  • Thermal and Power Management
  • Co-Design and Electronic Design Automation (EDA)
  • Photonics and Connectors
  • Advanced Packaging Prototyping 
  • Applications such as High-Performance Computing, including for AI; Low Power, Edge, and Mobile Applications; and Biomedical, Space, Automotive and other uses. 

We encourage interested stakeholders, industry representatives, technical experts and researchers, and industry alliances to participate actively in this pivotal event. We welcome both domestic and international participation, as fostering global collaboration and enriching the discussions on advancing semiconductor standards and innovation are paramount to success.

Note to Foreign National registrants (both in-person and virtual): In preparation for your attendance to the CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Summit, you will receive a NASA Identity Invitation email and a Pass Phrase email. Please be responsive to upload your identification information to the secure system. Registration for the summit near the deadline might not allow sufficient time to process your attendance request.

Advanced Packaging Summit Agenda
April 18–19, 2024
Held at NASA Ames Conference Center

DAY 1

8:00 – 9:00 am

Check-In

 

9:00 – 9:20 am

Intro, Review Agenda, Expectations & logistics

Intro / NAPMP

9:20 – 9:25 am

Opening Remarks DoC

Laurie Locascio, DoC

9:25 – 9:30 am

Opening Remarks NASA

Eugene Tu, NASA

9:30 – 9:50 am

DARPA & National Strategy on Microelectronics Research

Carl McCants, DARPA

9:50 – 10:10 am

Natcast

Deirdre Hanford, Natcast

10:10 – 10:30 am 

Break

Break

10:30 – 11:00 am

Semiconductor startup and investment landscape in 2024 … the worst and best of times

Daniel Armbrust, Silicon Catalyst

11:00 –11:30 am

NAPMP Overview

Daniel Berger, NAPMP

11:30 - 11:50 am

Chiplets

Bapi Vinnakota, NAPMP

11:50 – 1:00 pm

Lunch

Lunch

1:00 – 3:00 pm

Panel: Applications – HPC & AI

Panel

Mod:   John Shalf (DOE)

3:00 – 3:15 pm

Break

Break

3:15 – 4:30 pm

Panel: Applications – Aerospace & Automotive

Panel:

Mod: Scott Bukofsky, NSTC

4:30 – 5:30 pm

Panel:  Applications - Low Power

Panel

Mod:  George Orji, NAPMP

5:30 pm 

Wrap up, Adjourn

George Orji, NAPMP 

 

 DAY 2

8:30 – 9:00 am

Check-In (if needed)

 

9:00 – 9:05 am

Intro, Review Agenda & Logistics

Intro / NAPMP 

9:05 – 9:35 am

Semiconductors for the Future of Aerospace

Prasun Desai, NASA

9:35 – 10:05 am

Enabling Moore’s Law’s Through Heterogeneous Integration

Raja Swaminathan, AMD

10:05 – 10:20 am

Break

Break 

10:20 – 11:30 am

Panel: Support for Startups

Panel

Mod: Daniel Armbrust, Silicon Catalyst

11:30 – 12:30 pm

Lunch Break

Break

12:30 – 1:45 pm

Panel: Applications – Biomedical

Panel

Mod: Andy DeHennis

1:45 – 3:00 pm

Panel:  Packaging Pilot Needs & The Path to HVM

Panel

Mod: Erik Hadland (SIA)

3:00– 3:15 pm

Break

Break

3:15 – 4:15 pm

Panel:  Emerging Challenges to Advanced Packaging

Panel

Mod: Matt Kelly (IPC)

20 mins

Advanced Packaging Acceleration

K.C.  Hsu, TSMC

4:15 – 5:30 pm

Panel: Accelerating the Adoption of Advanced Packaging

Panel 

Mod:    Bapi Vinnakota, NAPMP

5:30 pm 

Closing Remarks, Adjourn

George Orji, NAPMP

For PDF, CLICK HERE

Program Committee:

David LaVan (CHIPS)

Bryan Biegel (NASA)

Bapi Vinnakota (CHIPS)

Greg Yeric (CHIPS)

Matt Kelly (IPC)

Matt Walsh (DoD – ReShape)

Erik Hadland (SIA)

Andrew DeHennis (CHIPS)

Note to Foreign National registrants (both in-person and virtual): In preparation for your attendance to the CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Summit, you will receive a NASA Identity Invitation email and a Pass Phrase email. Please be responsive to upload your identification information to the secure system. Registration for the summit near the deadline might not allow sufficient time to process your attendance request.

Per NASA policy regarding on-site meetings and conferences: Meetings and conferences that are held at a NASA Center are considered on-site meetings or conferences, regardless of the content of that meeting or conference. All on-site meetings and conferences are required to undergo full identity vetting. A full list of foreign national attendees must be provided to the IVC, through IdMAX, to ensure appropriate vetting occurs prior to the visit and to facilitate entry of the visitor to the meeting or conference. These foreign national attendees must be assigned an ACP and are required to follow all requirements of their ACP.

All visitors/guests will need to pass a photo identification (ID)* checkpoint.*US Citizens please see information regarding the REAL ID Act of 2005 below. International participants are required to present a passport.  Permanent residents are required to present their Green Card.

*Visitor Access Requirement:   

For Non-US Citizens:  Please have your valid passport for photo identification.   

For US Permanent Residents: Please have your green card for photo identification.   

For US Citizens: For US Citizens: Please have your state-issued driver's license. Regarding Real-ID requirements, all states are in compliance or have an extension through May 2025 

NASA also accepts other forms of federally issued identification in lieu of a state-issued driver's license, such as a valid passport, passport card, DOD's Common Access Card (CAC), Veterans ID, Federal Agency HSPD-12 IDs, and Military Dependents ID.

Created March 21, 2024, Updated April 15, 2024