The Suss MicroTec ACS200 is an automated photoresist coating and baking station with cassette-to-cassette substrate operation. It supports both spin coating and spray coating of photoresist on a variety of substrates. The tool provides complete resist coating capabilities, including hotplate baking up to 250 °C and automated edge-bead removal with backside rinse.
NanoFab Tool: Suss MicroTec ACS200 Automated Resist Coater
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Specifications/Capabilities
- Gyrset spin coat & Alta spray coat modules.
- 250 °C programmable hotplate.
- Automated edge-bead removal and back side rinse.
Usage Information
Supported Sample Sizes
- Maximum wafer diameter: 200 mm (8 in).
- Small pieces supported: Yes.
- Maximum substrate thickness: 5 mm.
- Wafer diameters supported:
- 50 mm (2 in).
- 75 mm (3 in).
- 100 mm (4 in).
- 150 mm (6 in).
- 200 mm (8 in).
- Photomask sizes supported:
- 125 mm x 125 mm.
- 150 mm x 150 mm.
Typical Applications
- Photoresist coating for optical pattern exposure.
- Photoresist coating for mask production.
Details
NEMO Name:
Suss ACS200
Location:
Building 215 Rm. A105 (Cleanroom)
Campus:
Gaithersburg
Hours of Operation
Cleanroom hours
Tool Reservation Rules
Tool Reservation Rules
- Minimum Reservation Time: 30 minutes.
- Maximum Reservation Time: 4 hours.
- Adjacent Reservations Permitted: No.
- Cancelation Policy: Reservations must be canceled at least 12 hours before the scheduled start time.
Hourly Rate
Standard Cost:
$149
Reduced Cost:
$80
Training Rates
Individual Cost:
$235
Group Cost:
$118
Training Time
Depends on user experience and process requirements; typically 2 hours.
Contact
-
Contact:
Richard Kasica, Primary Engineer
Liya Yu, Backup Engineer
Email: nanofab_litho@nist.gov
Phone: 1-877-NANO-US1
Address: 100 Bureau Drive, Stop 6201
Gaithersburg, MD 20899-6201
Created May 07, 2014, Updated October 19, 2018