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NanoFab Tool: Suss MicroTec ACS200 Automated Resist Coater

Schematic of the Suss MicroTec ACS200 Resist Coat System

The Suss MicroTec ACS200 is an automated photoresist coating and baking station with cassette-to-cassette substrate operation. It supports both spin coating and spray coating of photoresist on a variety of substrates. The tool provides complete resist coating capabilities, including hotplate baking up to 250 °C and automated edge-bead removal with backside rinse.


  • Gyrset spin coat & Alta spray coat modules.
  • 250 °C programmable hotplate.
  • Automated edge-bead removal and back side rinse.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 200 mm (8 in).
  • Small pieces supported: Yes.
  • Maximum substrate thickness: 5 mm.
  • Wafer diameters supported:
    • 50 mm (2 in).
    • 75 mm (3 in).
    • 100 mm (4 in).
    • 150 mm (6 in).
    • 200 mm (8 in).
  • Photomask sizes supported:
    • 125 mm x 125 mm.
    • 150 mm x 150 mm.

Typical Applications

  • Photoresist coating for optical pattern exposure.
  • Photoresist coating for mask production.
Created May 7, 2014, Updated November 21, 2019