The Microprocess Technology Avenger spray solvent lift-off tool uses a heated spray solvent to remove residual material and photoresist after deposition of a sacrificial layer. The tool provides "dry in, dry out" processes under recipe control to maximize lift-off efficiency while minimizing user exposure to chemicals.
Dry wafer in, dry wafer out process.
Automatic recipe control.
Quick change rotor system allows users to change wafer size.
Supported Sample Sizes
Maximum wafer diameter: 150 mm (6 in).
Wafer diameters: 75 mm (3 in), 100 mm (4 in), and 150 mm (6 in).