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NanoFab Tool: Heidelberg MLA150 Maskless Aligner

NanoFab Tool:  Heidelberg MLA150 Maskless Aligner

The MLA150 has been specifically designed for direct-wafer writing and easy operation. It offers all the capabilities that are required for single layer and multi-layer photolithography and even overcomes some of the limitations of photomask based exposure technologies because MLA150 exposure is non-contact approach. What set MLA150 apart from mask writer are the fast exposure speed, dual laser wavelengths and convenient alignment system. Alignment in multi-layer applications can be achieved automatically by using three integrated cameras with varying resolution while manual alignment is still available as needed.

Specifications/Capabilities

  • Minimum feature size: 1 µm.
  • Overlay accuracy (front): 500 nm
  • Overlay accuracy (back): 1000 nm
  • Maximum exposure area: 150 x 150 mm2
  • Exposure speed: 10-15 mins for 100 x 100 mm2
  • Light source: diode lasers, 8W at 405 nm and 2.8 W at 375 nm.
  • Substrate size: 6 x 6 mm2 to 200 x 200 mm2
  • Size detection: automatic
  • Alignment mode: front-size and back-size; automatic and manual

Typical Applications

  • Medical devices.
  • Biofluidic devices.
  • Microelectromechanical systems.
  • Thermal sensors.
  • Printing micrometer size and larger features.
Created March 5, 2018, Updated November 21, 2019