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NanoFab Tool: GnP 412S, Post-CMP Wafer Cleaner
Photo of the Post-CMP Wafer Cleaner
This tool removes the particulate residues resulting after wafer polishing using the CMP. These particles are typically a few tens of nanometers in size. The tool uses chemistries specific to the materials polished, which are delivered through double-sided PVA brushes wiping the wafer. The last DI water rinse is delivered with megasonic agitation that completely washes away all the particles. The wafer is finally spin-dried.
Specifications/Capabilities
- Sample sizes: 100 mm, 150 mm and 200 mm in diameter wafers
- Manual loading only, one wafer at a time
- Megasonic agitation in the final rinse
Usage Information
Operating Instructions
Typical Applications
- Post-CMP wafer cleaning
- General wafer cleaning