This tool removes the particulate residues resulting after wafer polishing using the CMP. These particles are typically a few tens of nanometers in size. The tool uses chemistries specific to the materials polished, which are delivered through double-sided PVA brushes wiping the wafer. The last DI water rinse is delivered with megasonic agitation that completely washes away all the particles. The wafer is finally spin-dried.
Sample sizes: 100 mm, 150 mm and 200 mm in diameter wafers