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NanoFab Tool: Disco DAD-341 Dicing Saw

Photograph of the Disco DAD-341 dicing saw.

The Disco DAD-341 dicing saw is used to cut multi-device substrates into individual chips. The system can accommodate substrates up to 4 mm thick and supports sizes ranging from 200 mm diameter wafers down to small pieces.

Specifications/Capabilities

  • Automatic mode for full wafer dicing.
  • Semi-automatic mode for custom cuts.
  • Measurement resolution: 0.1 µm.
  • Positioning accuracy: 0.5 µm.
  • Typical blade thickness (kerf): 35 µm to 200 µm.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 200 mm (8 in).
  • Small pieces supported: Yes.
  • Maximum thickness: 4 mm.

Typical Applications

  • Device separation after wafer processing.
  • Custom shaping of silicon, sapphire, Pyrex, quartz, silicon carbide, ceramics, and metals.
Created June 19, 2014, Updated October 19, 2018