The Disco DAD-341 dicing saw is used to cut multi-device substrates into individual chips. The system can accommodate substrates up to 4 mm thick and supports sizes ranging from 200 mm diameter wafers down to small pieces.
Automatic mode for full wafer dicing.
Semi-automatic mode for custom cuts.
Measurement resolution: 0.1 µm.
Positioning accuracy: 0.5 µm.
Typical blade thickness (kerf): 35 µm to 200 µm.
Supported Sample Sizes
Maximum wafer diameter: 200 mm (8 in).
Small pieces supported: Yes.
Maximum thickness: 4 mm.
Device separation after wafer processing.
Custom shaping of silicon, sapphire, Pyrex, quartz, silicon carbide, ceramics, and metals.