The Bruker Dektak XT contact profilometer measures the thin film thickness of patterned features by sensing the deflection of a fine stylus that is raster scanning over features ranging in height from 1 mm down to 5 nm. It is capable of mapping step heights and displaying topological three dimensional images of substrates ranging from 200 mm diameter wafers down to small pieces.
Maximum step height: 1 mm.
Vertical resolution: 0.1 nm.
Scan length: 50 um to 50 mm.
120,000 data points per scan.
Scans can be stitched end to end to span up to 150 mm.
Stylus force: 0.098 mN to 147 mN (0.01 mgf to 15 mgf).
Motorized X-Y-theta stage.
Wafer mapping up to 150 mm.
3-D topological imaging.
Supported Sample Sizes
Maximum wafer diameter: 200 mm (8 in).
Small pieces supported: Yes.
Maximum thickness: 50 mm.
Measurement of etch rates, deposition rates, and film growth rates.