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NanoFab Tool: Bruker Dektak XT Profilometer

Photograph of the Bruker Dektak XT contact profilometer.

The Bruker Dektak XT contact profilometer measures the thin film thickness of patterned features by sensing the deflection of a fine stylus that is raster scanning over features ranging in height from 1 mm down to 5 nm. It is capable of mapping step heights and displaying topological three dimensional images of substrates ranging from 200 mm diameter wafers down to small pieces.

Specifications/Capabilities

  • Maximum step height: 1 mm.
  • Vertical resolution: 0.1 nm.
  • Scan length: 50 um to 50 mm.
  • 120,000 data points per scan.
  • Scans can be stitched end to end to span up to 150 mm.
  • Stylus force: 0.098 mN to 147 mN (0.01 mgf to 15 mgf).
  • Motorized X-Y-theta stage.
  • Wafer mapping up to 150 mm.
  • 3-D topological imaging.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 200 mm (8 in).
  • Small pieces supported: Yes.
  • Maximum thickness: 50 mm.

Typical Applications

  • Measurement of etch rates, deposition rates, and film growth rates.
  • Measurement of surface roughness.
  • Thickness mapping.
Created May 21, 2014, Updated November 25, 2019