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Boulder

NIST UTC 2023 Archive

UTC - UTC (NIST) The deviation of UTC(NIST) from UTC has been less than +/-100 ns since July 6, 1994. The table below shows values of UTC -...

Close-up of a scientific instrument with wires and a circular metallic component, illuminated by blue light, featuring a small red dot at the center.

World’s Most Accurate and Precise Atomic Clock Pushes New Frontiers in Physics

July 1, 2024

The clock is the latest demonstration that a much more precise definition of the official second is possible and that new applications of clocks are feasible.

Sae Woo Nam Posthumously Receives Ho-Am Prize

The Ho-Am Prize is presented each year to individuals who have contributed to academics, the arts, and social development, or who have

A photo of the night sky with greenish lights on the right.

Spotlight: Geomagnetic Storm Creates Bright Northern Lights While Also Affecting NIST’s Cesium Clocks

May 21, 2024

Did you see the northern lights recently? NIST’s cesium fountain clocks did.

With Some Bumps, NIST Scientists Devise a Novel Way to Extend the Wavelength Range of Microcombs

June 5, 2024

Microcombs – chip-scale devices that generate and measure frequencies of light with exquisite accuracy – have transformed timekeeping and boosted optical

2024 - ACS Colorado Annual Section Award---Jason Widegren

Dr. Jason Widegren of the NIST Material Measurement Laboratory was presented with the 2024 ACS Colorado Section Award on May 8, 2024. A

2023 Distinguished Associate Award - Johnathon Gard

For the development of a cryogenic camera based on superconducting sensors and for its first use in space to obtain X-ray images of a

2023 Distinguished Associate Award - Malcolm Durkin

For the development of a cryogenic camera based on superconducting sensors and for its first use in space to obtain X-ray images of a

2023 Distinguished Associate Award - Bryce Primavera

For the monolithic integration of superconducting single-photon detectors with Josephson junctions for advanced computing and single-photon

2023 Distinguished Associate Award - Saeed Kahn

For the monolithic integration of superconducting single-photon detectors with Josephson junctions for advanced computing and single-photon

CHIPS R&D Standardization Readiness Level Workshop

Tue, Jun 4 - Wed, Jun 5 2024

CHIPS R&D Standardization Readiness Level (StRL) Workshop June 4-5, 2024 The CHIPS Research and Development Office’s

The Big Quantum Chill: NIST Scientists Modify Common Lab Refrigerator to Cool Faster With Less Energy

April 23, 2024

By modifying a refrigerator commonly used in both research and industry, researchers at the National Institute of Standards and Technology (NIST) have

Josephson Voltage Standard Workshop (JVS Workshop)

Mon, Jul 15 - Tue, Jul 16 2024

The scope of the 2024 Josephson voltage standard workshop is focused on the Josephson arbitrary waveform synthesizer

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

CHIPS Metrology NOFO on Small Business Innovation Research (SBIR)

Thu, Apr 18 2024, 3:30pm EDT

CHIPS for America recently released a notice of funding opportunity (NOFO) for the FY24 Small Business Innovation

RF Metrology for High-Frequency Transistor Models

Advanced semiconductor technology has led to continuous performance improvements in transistors. However, many iterations are needed to obtain optimal

RF Channel Propagation Measurements and Models for Communications Circuits

An accurate characterization of how the wireless signal propagates through different environments and frequency bands, is key to developing radio frequency (RF)

Quantitative Assessment of Defects and Related Modeling Parameters in GaN Semiconductor Devices

The power electronics and radio frequency (RF) communications industries increasingly rely on semiconductors in the GaN/AlGaN family, where performance is

Nanocalorimetry for Semiconductors and Semiconductor Process Metrology

Advanced methods to measure the thermal properties of thin films and interfaces are required to understand and improve microelectronic device fabrication

Multiscale Modeling and Validation of Semiconductor Materials and Devices

A comprehensive understanding of how current and next-generation materials impact the performance of semiconductor devices is critical to U.S. Semiconductor

2024 Time and Frequency Seminar

Tue, Aug 13 - Thu, Aug 15 2024

NIST Time and Frequency Division's annual seminar covers precision clocks and oscillators, atomic frequency standards

Molecular Dynamics Simulation of Heat Transport in Gate-All-Around Transistors

Heat management in semiconductor devices is a crucial problem currently limiting device performance and essentially all progress involving reduction of device

Dynamic EUV Metrology of Nanoscopic Thermal Transport in Active Devices

An urgent objective of the microelectronics industry is to mitigate the extreme heat densities generated within devices that are limiting the performance of

Today, device performance needs to be evaluated to determine success of materials development. This project will advance metrology for magnetic materials and develop models to predict device performance.

High Speed Metrology for Magnetoelectronic Devices and Models

Ferromagnet-based microelectronic devices play an increasingly important role within the semiconductor ecosystem. Magnetic RAM (MRAM) is already replacing

EUV Scatterometry

The state of the art for measurement and inspection of the smallest printed features on an integrated circuits (IC) chip is a combination of electron scanning

Electro-acoustic Metrology of Piezoelectric Materials for Wireless Communications

Microwave acoustic resonators are widely used to filter signals on multiple frequency bands for mobile communications. To predict filter performance, industry

a conceptual diagram of a gate-all-around (GAA) field-effect transistor

Causal Green's function simulations of phonons for multiscale/multiphysics modeling of thermal transport in gate-allaround transistors

This project employs a causal Green’s function (CGF) method to model thermal transport in nanoscale semiconductors, overcoming limitations posed by the Fourier

Characterization of Nano-to-Microscale Process-Induced Thermo-Mechanical Changes in Heterogeneously Integrated Microelectronics

Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and