This proposed CHIPS for America investment would support Bosch’s planned investment to transform its manufacturing facility in Roseville, California, for production of silicon carbide (SiC) power semiconductors.

The award will support Applied Materials in developing and scaling a disruptive silicon-core substrate technology for next-generation advances in packaging and 3D heterogeneous integration.

The proposed CHIPS investment would support the construction of a 40,000 square foot cleanroom space within an existing building to transform it into a facility for semiconductor manufacturing with various Diamond Cooling substrates, devices, and systems at scale.

Keysight Technologies' proposed project, "AI for Accelerating RFIC Design Efficiency, Innovation, and Optimization for U.S. Competitiveness," seeks to automate complex design tasks using AI-driven tools. The Keysight team, drawing on expertise from major commercial and defense companies, universities, and innovative startups, aims to make the AI-enhanced workflow accessible to designers of all experience levels. By driving automation, optimization, and generation of advanced and unique RFIC designs, the project will improve the productivity and competitiveness of participating members in the U.S. semiconductor industry and, itself, become a key framework for innovation.

The CHIPS for America investment would support the construction of a new, modernized fab and foundry with over 40,000 square feet of cleanroom space, which would increase its InP PIC manufacturing to meet future capacity and capability demands.

The purpose of this grant is to establish an Entrepreneurial Fellowship Pilot program that will fund up to 10 early-stage companies ("Fellows") focused on innovations in semiconductor manufacturing technologies. The Pilot will establish a framework for other CHIPS-funded businesses to integrate innovative semiconductor ideas and technology into the semiconductor R&D ecosystem.

The UCLA Samueli School of Engineering will use anticipated funding to establish the Center for Education of Microchip Designers (CEMiD), which will provide comprehensive training in analog and digital chip design to engineering students and practicing engineers.

Develop cutting-edge technology for calibration of the instrument transfer function of extreme ultraviolet (EUV) lithographic tools. This project will advance EUV lithography technology for the U.S. semiconductor industry.

Develop a measurement technology for in-line metrology, which has applications in materials purity, electrical properties, three-dimensional devices, and next generation manufacturing. This project will benefit the U.S. metrology and advanced packaging industries.

Develop a novel linear accumulation x-ray source to achieve an order of magnitude increase in performance over leading x-ray sources for critical dimension scattering. This project benefits researchers and manufacturers of semiconductor transistors.