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Wire Bonding--Towards 6 sigma Yield and Fine Pitch

Published

Author(s)

George G. Harman
Proceedings Title
Proc., 42nd Electronic Components and Technology Conference
Conference Dates
May 18-20, 1992
Conference Location
San Diego, CA

Citation

Harman, G. (1992), Wire Bonding--Towards 6 sigma Yield and Fine Pitch, Proc., 42nd Electronic Components and Technology Conference, San Diego, CA (Accessed July 21, 2024)

Issues

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Created December 31, 1992, Updated February 17, 2017