Harman, G.
(1997),
Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield, 2nd Edition, , NY
(Accessed April 25, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield, 2nd Edition
Published
Author(s)
Citation
McGraw-Hill
Publisher Info
, NY
Pub Type
Books
Citation
Created August 1, 1997, Updated February 17, 2017