Harman, G.
(1997),
Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield, 2nd Edition, , NY
(Accessed December 12, 2024)
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Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield, 2nd Edition
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McGraw-Hill
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, NY
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Books
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Created August 1, 1997, Updated February 17, 2017