Shuman, S.
, Gaitan, M.
, Joshi, Y.
and Harman, G.
(2001),
Wire Bond Temperature Sensor, Proc., IMAPS, Baltimore, MD, USA
(Accessed March 25, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Wire Bond Temperature Sensor
Published
Author(s)
, , ,
Proceedings Title
Proc., IMAPS
Conference Dates
October 9-11, 2001
Conference Location
Baltimore, MD, USA
Conference Title
2001 IMAPS
Pub Type
Conferences
Keywords
CMOS, Wire Bond
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created October 31, 2001, Updated October 12, 2021