Sanders, A.
, Fox, A.
and Dresselhaus, P.
(2015),
Using 3D Nanotomography to Visualize Defects in the Fabrication of Superconducting Electronics, Microscopy and Microanyalsis, Portland, OR, [online], https://doi.org/10.1017/S1431927615010004
(Accessed September 19, 2024)
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Using 3D Nanotomography to Visualize Defects in the Fabrication of Superconducting Electronics
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Abstract
Superconducting electronics is an established technological field for sensors, quantum computation and quantum-based standards and is emerging as an important low-power alternative to semiconductors. As in any electronics fabrication, the production of complex circuits requires many iterations and stringent quality control. In particular post-fabrication metrology of buried circuit elements to diagnose device failures is of utmost importance to increasing the yield and complexity of superconducting based electronics. To fill this need, we have developed methods for the 3D visualization of superconducting electronic components based on focused ion beam scanning electron (FIB-SEM) nanotomographyProceedings Title
Microscopy and Microanyalsis
Volume
21
Conference Dates
August 2-6, 2015
Conference Location
Portland, OR
Pub Type
Conferences
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Keywords
tomography, nanoscience, superconducting electronics
Citation
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Created September 23, 2015, Updated November 10, 2018