Skip to main content
U.S. flag

An official website of the United States government

Dot gov

The .gov means it’s official.
Federal government websites often end in .gov or .mil. Before sharing sensitive information, make sure you’re on a federal government site.

Https

The site is secure.
The https:// ensures that you are connecting to the official website and that any information you provide is encrypted and transmitted securely.

TSV REVEAL HEIGHT AND BUMP DIMENSION METROLOGY BY THE TSOM METHOD: FROM NANOMETER TO MICROMETER SCALE

Published

Author(s)

Ravikiran Attota, Victor Vertanian, Steve Olson, Robert Edgeworth, Iqbal Ali, Craig Huffman, Pate Moschak, Harry Lazier, Elizabeth Lorenzini

Abstract

The exceptional z-height resolution of TSOM, as well as very fast measurement time, is particularly important for high volume manufacturing. These two attributes make TSOM advantageous for 3D-stacked IC measurements of TSV reveal structures, and C4 bumps and microbumps. This work focuses on the application of TSOM to through-silicon via (TSV) reveal height measurements in the 3-5 micron range, as well as to C4 and micro-bump features. In addition, the sensitivity of the technique to TEOS liner thickness of a few nm in 2 x 40 m TSV’s as well as step coverage will be using simulations.
Conference Dates
March 25-28, 2013
Conference Location
Gaithersburg, MD
Conference Title
Frontiers of Characterization and Metrology for Nanoelectronics

Keywords

TSOM, TSV, Cu reveal, nanometrology, 3D metrology, through-focus, optical microscope
Created January 23, 2013, Updated February 19, 2017