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Transient Heating Study of Microhotplates by Using a High-Speed Thermal Imaging System

Published

Author(s)

Muhammad Afridi, David W. Berning, Allen R. Hefner Jr., John S. Suehle, Mona E. Zaghloul, Eric Kelley, Zharadeen R. Parrilla, Colleen E. Hood

Abstract

A high-speed thermal imaging system is used to investigate the dynamic thermal behavior of MEMS-based (MicroElectroMechanical Systems) microhotplate devices. These devices are suspended microstructures fabricated in CMOS technology and are used in various sensor applications. Measurements reveal delayed surface heating of the microhotplate and temperature redistribution during both the heating and cooling phases. Reflected infrared (IR) radiation from the hidden backside of the heater is used with a normalization technique to determine peak heater temperature. The measured results are shown to be useful in optimizing the design of microhotplate structures. It is found that the use of a heat-spreading layer improves the local temperature uniformity between the heater strips. It is also found that the use of the thinner layers of the 1.5-um CMOS-based technology improves the global temperature uniformity over the top surface of the microhotplate.
Proceedings Title
Proc., SEMI-THERM
Conference Dates
March 12-14, 2002
Conference Location
San Jose, CA, USA
Conference Title
IEEE SEMI-THERM SYMPOSIUM

Keywords

High-Speed Thermal Imaging, MEMS, Microhotplate, Thermal Characterization, Thermal Imaging, Thermal Transient Imaging

Citation

Afridi, M. , Berning, D. , Hefner Jr., A. , Suehle, J. , Zaghloul, M. , Kelley, E. , Parrilla, Z. and Hood, C. (2002), Transient Heating Study of Microhotplates by Using a High-Speed Thermal Imaging System, Proc., SEMI-THERM , San Jose, CA, USA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=14143 (Accessed May 20, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created February 28, 2002, Updated October 12, 2021