Kim, M.
, Ropitault, T.
, Lee, S.
and Golmie, N.
(2017),
Throughput Study for Channel Bonding in IEEE 802.11ac Networks, IEEE Communications Letters, [online], https://doi.org/10.1109/LCOMM.2017.2747511
(Accessed October 6, 2025)
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Throughput Study for Channel Bonding in IEEE 802.11ac Networks
Published
Author(s)
, , SuKyoung Lee,
Abstract
Several analytical models for the channel bonding feature of IEEE 802.11ac have been presented for performance estimation. However, the accuracy of such models is limited by the assumptions that there are no collisions or all nodes are in saturated state. Therefore, in this letter, we develop an analytical model for the throughput performance of channel bonding in IEEE 802.11ac considering the presence of collisions under both saturated and non-saturated traffic loads. Our numerical results are validated by simulations.Citation
IEEE Communications Letters
Volume
21
Issue
12
Pub Type
Journals
Download Paper
Keywords
Channel bonding, throughput, 802.11ac.
Citation
Issues
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Created December 1, 2017, Updated May 30, 2020