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PUBLICATIONS

Throughput Study for Channel Bonding in IEEE 802.11ac Networks

Published

Author(s)

Munsuk Kim, Tanguy Ropitault, SuKyoung Lee, Nada T. Golmie

Abstract

Several analytical models for the channel bonding feature of IEEE 802.11ac have been presented for performance estimation. However, the accuracy of such models is limited by the assumptions that there are no collisions or all nodes are in saturated state. Therefore, in this letter, we develop an analytical model for the throughput performance of channel bonding in IEEE 802.11ac considering the presence of collisions under both saturated and non-saturated traffic loads. Our numerical results are validated by simulations.
Citation
IEEE Communications Letters
Volume
21
Issue
12
Pub Type
Journals

Download Paper

https://doi.org/10.1109/LCOMM.2017.2747511
Local Download

Keywords

Channel bonding, throughput, 802.11ac.
Wireless (RF)

Citation

Kim, M. , Ropitault, T. , Lee, S. and Golmie, N. (2017), Throughput Study for Channel Bonding in IEEE 802.11ac Networks, IEEE Communications Letters, [online], https://doi.org/10.1109/LCOMM.2017.2747511 (Accessed April 19, 2024)

Created December 1, 2017, Updated May 30, 2020