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A Thermo-Viscoelastic Model for the Modulus of Epoxy during Cure

Published

Author(s)

S L. Simon, O Sindt, G B. McKenna
Conference Location
New York, NY
Conference Title
ANTEC '99 Conference Proceedings

Keywords

Mechanical properties, Thermal properties, Thermosets, cure, epoxy, glass transition, time-conversion superposition, time-temperature superposition, viscoeleatic properties

Citation

Simon, S. , Sindt, O. and McKenna, G. (1999), A Thermo-Viscoelastic Model for the Modulus of Epoxy during Cure, ANTEC '99 Conference Proceedings, New York, NY, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853721 (Accessed March 3, 2024)
Created December 31, 1998, Updated October 12, 2021