Ortiz, J.
, Hernandez, M.
, Duong, T.
, Leslie, S.
and Hefner, A.
(2008),
Thermal Network Component Models for 10 kV SiC Power Module Packages, Proc., IEEE Power Electronics Specialist Conference, Rhodes, -1, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=33007
(Accessed October 14, 2025)
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Thermal Network Component Models for 10 kV SiC Power Module Packages
Published
Author(s)
, , , Scott G. Leslie,
Abstract
The DARPA WBGS-HPE program is developing 100 A, 10 kV SiC power modules to demonstrate the viability of a 2.75 MVA Solid State Power Substation that uses 10 kV, 20 kHz switching-capable devices. Thermal network component models for these modules are developed and are validated with temperature measurements obtained through various methods for a range of power dissipation levels. The models include the direct-bond-copper materials required to obtain 15 kV baseplate isolation and are parameterized in terms of the structural and material properties of the package to provide flexibility for different configurations. This enables the use of electro-thermal simulations to optimize SiC module parameters for specific system requirements.Proceedings Title
Proc., IEEE Power Electronics Specialist Conference
Conference Dates
June 15-19, 2008
Conference Location
Rhodes
Conference Title
IEEE Power Electronics Specialist Conference
Pub Type
Conferences
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Created June 13, 2008, Updated February 19, 2017