Rule, D.
, Smith, D.
and Sparks, L.
(1990),
Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler:, , National Institute of Standards and Technology, Gaithersburg, MD, [online], https://doi.org/10.6028/NIST.IR.3948
(Accessed December 14, 2024)